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Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

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Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

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Brand Name :NVIDIA
Model Number :AGX orin 64G module
Place of Origin :USA
MOQ :1PCS
Price :USD1680-USD1700/PCS
Payment Terms :L/C, D/A, D/P, T/T
Supply Ability :20pcs 15-30 work days
Delivery Time :15-30 work days
Packaging Details :100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate
NAME :Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS
Keyword :Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS
AI Performance :275 TOPS (INT8)
GPU :2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores
GPU Max Frequency :1.3 GHz
CPU :12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
CPU Max Freq :2.2 GHz
Memory :64GB 256-bit LPDDR5 204.8GB/s
Storage :64GB eMMC 5.1
Other I/O :4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs
Power :15W - 60W
Mechanical :100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate
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Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

NVIDIA Jetson AGX Orin 64GB Multi Chip Module

275 Sparse | 138 Dense INT8 TOPS | 15W to 60W

NVIDIA Isaac Platform for Robotics

Robots create new efficiencies and improve quality of life through industries such as manufacturing, logistics, healthcare, and service. NVIDIA Isaac™ accelerates the process with enhanced robotics development, simulation, and deployment.

Accelerating and enhancing robotics—from development to simulation to deployment.

From smart automation in manufacturing to last-mile delivery, robots are becoming more ubiquitous in everyday life. However, industrial and commercial robotics development can be complex, time consuming, immensely challenging, and expensive. Unstructured environments across many use cases and scenarios are also common. The NVIDIA Isaac™ robotics platform addresses these challenges with an end-to-end solution to help decrease costs, simplify development, and accelerate time to market.

NVIDIA Jetson AGX Orin 64GB Module Technical Specifications

Module

NVIDIA Jetson AGX Orin 64GB

AI Performance

275 TOPS

GPU

2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores

GPU Max Frequency

1.3 GHz

CPU

12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3

CPU Max Frequency

2.2 GHz

DL Accelerator

2x NVDLA v2

DLA Max Frequency

1.6 GHz

Vision Accelerator

1x PVA v2

Memory

64GB 256-bit LPDDR5
204.8GB/s

Storage

64GB eMMC 5.1

Camera

Up to 6 cameras (16 via virtual channels)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)

Video Encode

2x 4K60 (H.265)​
4x 4K30 (H.265)​
8x 1080p60 (H.265)​
16x 1080p30 (H.265)​

Video Decode

1x 8K30 (H.265)​
3x 4K60 (H.265)​
7x 4K30 (H.265)​
11x 1080p60 (H.265)​
22x 1080p30 (H.265)​

PCIe

Up to 2 x8 + 1 x4 + 2 x1
(PCIe Gen4, Root Port, & Endpoint)

Networking

1x GbE
1x 10GbE

Power

15W - 60W

Mechanical

100mm x 87mm
699-pin Molex Mirror Mezz Connector
Integrated Thermal Transfer Plate



Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

The end-to-end Isaac robotics platform.

Accelerate the development process with enhanced robotics development, simulation, and deployment.

Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS

Temperature range (at Thermal Transfer Plate (TTP) surface)

-25 °C to 80 °C

Operating humidity

5% to 85% RH

Storage temperature (Ambient)1

-25 °C to 80 °C

Storage humidity

30% to 70% RH

Note: See the NVIDIA Jetson AGX Orin Design Guide for details on the UPHY configurations supported. MGBE, USB 3.2, and PCIe share UPHY Lane.

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