Beijing Plink AI Technology Co., Ltd
Beijing Plink AI is an expert of cloud-to-end one-stop solution.
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NVIDIA Jetson AGX Orin 64G
Up to 275 TOPS (INT8)
Arm Cortex-A78AE CPU
Maximum Module Power: Up to 60 W
64GB 256-bit LPDDR5 DRAM
64GB eMMC 5.1 Flash Storage | Bus Width: 8-bit | Maximum Bus Frequency: 200 MHz (HS400 or HS533)
See PLINK's Isaac platform deployed at the edge for autonomous mobile robotics, industrial automation, healthcare, retail, agriculture, and more.
Robots are virtually trained and tested in photorealistic and physically accurate environments using NVIDIA Isaac Sim operating in the NVIDIA Omniverse virtual environment.
High-performance robotics applications can be developed using hardware-accelerated SDKs such as Isaac ROS GEMs for ROS-based robots, the NVIDIA DeepStream SDK for streaming video understanding, NVIDIA Riva for natural language processing, and the Isaac SDK for a complete framework.
Only NVIDIA offers a complete end-to-end workflow to enable seamless deployment. Robotics applications can be ported onto NVIDIA edge devices from NVIDIA Jetson to EGX edge computers to create truly autonomous machines. Scaling services across distributed edge cases are also available on EGX Fleet Command.
NVIDIA Jetson AGX Orin 64GB Embedded Computer
Technical Specification
| Color | Black |
Module | NVIDIA Jetson AGX Orin 64G |
AI Performance | 275 TOPS |
| GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 |
Video Encode | 2x 4K60 (H.265) |
Video Decode | 1x 8K30 (H.265) |
| CAN | 2 |
| GPIO | 4 |
| SPI | 1 |
| I2C | 2 |
| RS 232 | 2 |
| 10/100/1000 Ethernet/RJ45 | 2 |
| Debug | 1 |
| Temperature Range | -20~+65°C |
| Power Supply | AC 220V |
| Dimensions | 430 mm × 360 mm × 88mm |
| Weight | 6050g |