Beijing Plink AI Technology Co., Ltd
Beijing Plink AI is an expert of cloud-to-end one-stop solution.
Add to Cart
8G Copper Nvidia Jetson TX2 Cooling Fan Silicone Grease Heat Sink
Jetson TX2 FAN
TX2 8G Developer Kit PLINK TX2-DEV
Y-C1 Carrier Board + NVIDIA Jetson TX2 Module + Cooling FAN
Storage
eMMC 5.1 Flash Storage
| Bus Width | 8-bit |
| Maximum Bus Frequency | 200MHz (HS400) |
| Storage Capacity | 32GB |
Applications
Intelligent Video Analytics, Drones, Robotics, Industrial automation, Gaming, and more.
| Support Equipment | TX2 8G Module |
| Power | 5V |
| Size | 88mm*50mm*16mm |
| Package size | 150mm*102mm*40mm |
Plink TX2-DEV
NVIDIA Jetson TX2 8G Module Technical Specification
| AI Performance | 1.33 TFLOPS |
| GPU | 256-core NVIDIA Pascal™ GPU |
| CPU | Dual-core Denver 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor |
| Memory | 8 GB 128-bit LPDDR4 |
| Storage | 32 GB eMMC 5.1 |
| Power | 7.5W | 15W |
| PCIe | 1 x1 + 1 x4 OR 1 x1 + 1 x1 + 1 x2 |
| Display | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 |
| Networking | 10/100/1000 BASE-T Ethernet, WLAN |
| Mechanical | 87 mm x 50 mm |