Beijing Plink AI Technology Co., Ltd
Beijing Plink AI is an expert of cloud-to-end one-stop solution.
Add to Cart
64G V2X Internet Of Vehicles Embedded PC Board System Jetson AGX Orin
Module: NVIDIA Jetson AGX Orin,The Y-C8 is an embedded system development board which is based on NVIDIA Jetson AGX Orin module, The NVIDIA AGX series module has up to 275 TOPS, usually for V2X and smart cities.The Cortex-R5 processor in the Always On (AON) block is also referred to as the Sensor Processing Engine (SPE). The AON cluster provides all the necessary hardware features to support low power sensor management and wake use cases. The cluster consists of an Arm Cortex-R5 processor core with a tightly coupled RAM, supporting peripherals (such as timers and an interrupt controller), various I/O controller peripherals, and routing logic.
AON Cortex-R5 implementation:
| Product Name | Y-C8-orin |
| Module | NVIDIA Jetson AGX Orin |
| GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores |
| CPU | 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
| USB Micro-B | 1 x Type B (OTG) |
| USB Type-A | 2 x USB 3.1 |
| Networking | 1 x 10/100/1000 Ethernet/RJ45 |
| Power Supply | DC +12V |
| Other I/O | 4 x GPIO(3.3V) | 1 x SPI(3.3V) | 2 x I2C(3.3V) | 2 x RS 232 | 1 x Debug(UART) |
| Temperature | -20~+65°C |
| Size | 170mm×170mm×34mm |
| Weight | 260g |
NVIDIA Jetson AGX Orin Module Technical Specifications
| Module | NVIDIA Jetson AGX Orin 32G | NVIDIA Jetson AGX Orin 64G |
| AI Perf | 200 Sparse TOPS (INT8) | 275 Sparse TOPS (INT8) |
| CPU | Arm® v8.2 (64-bit) | 8× Arm Cortex-A78AE cores | 2 CPU clusters (4 cores/cluster) | 177 SPECint_rate2006 | Arm® v8.2 (64-bit) | 12× (up to 6× lock step) Arm Cortex- A78AE cores | 3 CPU clusters (4 cores/cluster) | 259 SPECint_rate2006 |
| GPU | Ampere GPU 2 GPC | 7 TPC | Up to 108 INT8 Sparse TOPS or 54 FP16 TFLOPS (Tensor Cores) | Ampere GPU 2 GPC | 8 TPC | Up to 170 INT8 Sparse TOPS or 85 FP16 TFLOPS (Tensor Cores) | Up to 5.32 FP32 TFLOPS or 10.649 FP16 TFLOPS (CUDA cores) |
| Memory | 32 GB LPDDR5 | 64 GB LPDDR5 |
| Storage | 64 GB eMMC 5.1 | |
| Networking | 1x GbE | 4x 10GbE | |
| USB | 3x USB 3.2 Gen2 (10 Gbps) | |
| Power | 15W - 40W | 15W - 60W |
| Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate | |
